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FUJITSU MICROELECTRONICS DATA SHEET
DS04-32101-1Ea
ASSP SmartCard
Microcontroller for Multiapplication SmartCard
HIFERRON Series
MB94R215B
DESCRIPTION
MB94R215B is a one-chip micro-controller for IC cards, with a combination of contact/contactless functions. Based around the FR65E core, it includes in built functions such as a timer, FRAM, DES, RSA, contact interface, contactless RF interface, etc. The MB94R215B is optimized for contact/contactless IC card applications.
FEATURE
* FR CPU * 32-bit RISC, load/store architecture with a five-stage pipeline * 16 - bit fixed length instructions (basic instructions), 1 instruction per cycle * Instruction set optimized for embedded applications : Memory-to-memory transfer, bit manipulation, barrel shift etc. * Instructions adapted for high - level languages : Function entry/exit instructions, multiple - register load/store instructions * Register interlock functions : Facilitating coding in assemblers * Built-in multiplier with instruction-level support 32-bit multiplication with sign : 5 cycles 16-bit multiplication with sign : 3 cycles * Interrupt (PC and PS save) : 6 cycles, 16 priority levels * Harvard architecture allowing program access and data access to be executed simultaneously * Instruction compatible with FR family (Continued)
Copyright(c)2004-2008 FUJITSU MICROELECTRONICS LIMITED All rights reserved 2004.10
MB94R215B
(Continued) * Contactless IC card I/F * Operating magnetic field strength : 4.0 to 7.5 A/m (in recommended antenna pattern) * Load modulation strength (Min) : 30/H1.2 (mVpeak) (in recommended antenna pattern) * Antenna input pin capacity : 75 pF * Communication protocol : ISO 14443 TypeB T = CL 106 Kbps, 212 Kbps Input clock frequency = 13.56 MHz * Receive data demodulation and send data modulation for contactless I/F * Variety of error detection function (frame, overrun, exceeding ISO regulation time) * Contact IC card I/F (5 V I/F) * Support for power supply voltage = 5 V 0.5 V and input clock frequency = 1 MHz to 5 MHz (ISO 7816 Class-A) * Communication protocol : ISO 7816/T = 0, 1 Operation is confirmed for Fi = 372 with Di = 1, 2, 4, 8, and for Fi = 512 with Di = 1, 2, 4, 8, 16. * Built-in memory * MASK ROM of 128 KB * DATA RAM (SRAM) of 8 KB * FRAM (Nonvolatile memory) of 32 KB * Cryptosystem coprocessor * DES coprocessor * ECB mode corresponding (The CBC mode corresponds by XOR and transfer instruction.) * Operating at 20 coproclocks * RSA coprocessor * Maximum key length 1024 bits * High-speed Montgomery multiplication surplus (REDC) calculations using 32-bit data processing * ECC (Prime Finite Fields) : Maximum key length 224 bits
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MB94R215B
PIN ASSIGNMENT
R 2.20 R 2.00
3.00
1
5
0.20
2.40
2
6
11.40
0.20
2.40
3
7
0.20 3.00
4
8
0.20 4.10 0.20 4.00 12.00 0.20 4.10
Unit : mm (Continued)
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MB94R215B
(Continued)
11.80 9.00 9
1.00
2.00
R 1.00
13.00
9.50
0.50
5.00
5.00
10 (0.46) 0.195 0.05 1.80 2.00 0.90
Unit : mm
Pin No. 1 2 3 4 5 6 7 8 9 10
Pin Name VCC RST CLK RFU GND VPP I/O RFU PWRP PWRM
Chip Correspondence EXT5V INITX CLK N.C. VSS N.C. SDIO N.C. PWRP PWRM Power supply pin* Reset input* Clock input* Empty pin* Ground pin*
Function
Program power supply (not used in this module) * Data input/output* Empty pin* Antenna pin for contactless. Located on rear of module Antenna pin for contactless. Located on rear of module
* : Refer to ISO/IEC7816-2. 4
MB94R215B
BLOCK DIAGRAM
FR CPU core
32
32
Bit search
SRAM 8 KB
ROM 128 KB
Bus converter
FRAM 32 KB
RSA
DES
32
32 to 16 adapter
PLL
Clock generator
16
Power supply warning and detection circuit Interrupt controller 3 ch reload timer
PWRP PWRM
Contactless RF I/F
Interrupt management
INITX CLK SDIO BSIO
Each register Contact I/F
CLK/RST controller
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MB94R215B
HANDLING DEVICES
1. Preventing Latchup
Latch-up may occur in a CMOS IC if a voltage greater than VCC or less than VSS is applied to an input or output pin, or if an above-rating voltage is applied between VCC and VSS. A latchup, if it occurs, significantly increases the power supply current and may cause thermal destruction of an element. When you use a CMOS IC, be very careful not to exceed the absolute maximum rating.
2. Treatment of N.C. pins
Be sure to use NC pins in open state.
3. Rising time for power supply voltage
Ensure that the power supply rise time is 100 s or less when using contact mode operation but, which may cause misoperation resulting in the corruption of FRAM data.
4. Power supply off time
Ensure that the power supply off time is 1ms or longer when using contact mode operation.
5. Magnetic field strength rise time
See the " RF INTERFACE in CONTACTLESS OPERATION" section for points to note regarding contactless operation.
6. When using both contact and contactless operation
When operating in contact mode, ensure there is no RF input from the antenna. When operating in contactless mode, ensure that the contact terminals are open circuit.
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MB94R215B
ABSOLUTE MAXIMUM RATINGS
Parameter Power supply voltage Input voltage Output voltage Operating temperature Storage temperature Voltage between antenna pins (Peak-Peak voltage) Symbol VCC VIN VOUT TA TSTG VANT Rating Min - 0.5 - 0.5 - 0.5 - 20 - 40 Max 6.0 VCC + 0.5 VCC + 0.5 + 80 + 85 20 Unit V V V C C V
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
RECOMMENDED OPERATING CONDITIONS
Parameter Power supply voltage "H" level input voltage "L" level input voltage Operating temperature Operating magnetic field strength* Load modulation level Voltage between antenna pins (Peak-Peak voltage) * : In reference antenna pattern WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their representatives beforehand. Symbol VCC VIN VOUT TA VANT Value Min 4.5 - 0.5 - 20 4.0 30 Typ 5.0 Max 5.5 VCC + 0.5 + 0.6 + 80 7.5 20 Unit V V V C A/m 1/H1.2 (mVpeak) V
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MB94R215B
ELECTRICAL CHARACTERISTICS
1. DC Characteristics
(1) Power supply voltage and current Parameter Operating power supply current Standby current Symbol ICC ICS Conditions *1 *2 Value Min Typ Max 8.0 2.0 Unit mA mA
*1 : 4.5 V < VCC < 5.5 V, CLK input = 3.57 MHz, no PLL using, at Java Card OS operating *2 : 4.5 V < VCC < 5.5 V, CLK stop (2) I/O pin Parameter "H" level input voltage "L" level input voltage "H" level input current "L" level input current "H" level output voltage "L" level output voltage "H" level output current "L" level output current *1 : VCC = 5.5 V *2 : Chip external pull-up resistance : 20 k *3 : IOL = 1 mA *4 : VOH = 0.7 x VCC *5 : VOL = 0.15 x VCC (3) CLK pin Parameter "H" level input voltage "L" level input voltage "H" level input current "L" level input current * : VCC = 5.5 V Symbol VIH VIL IIH IIL Conditions * * Value Min 0.7 x VCC 0.0 - 10 - 100 Typ Max VCC 0.5 + 10 + 10 Unit V V A A Symbol VIH VIL IIH IIL VOH VOL IOH IOL Conditions *1 *1 *2 *3 *4 *5 Value Min 0.7 x VCC 0.0 - 10 - 200 0.7 x VCC 0.0 - 1000 - 0.01 Typ Max VCC 0.15 x VCC + 10 + 10 VCC 0.15 x VCC + 10 + 8.0 Unit V V A A V V A mA
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MB94R215B
(4) RST pin Parameter "H" level input voltage "L" level input voltage "H" level input current "L" level input current * : VCC = 5.5 V (5) Antenna pin Parameter Capacity between antenna pins Load modulation circuit resistance Symbol Cant Rmod Conditions 0.1 Vrms Resistance between antenna and GND Value Min 60 600 Typ 68 750 Max 75 900 Unit pF Symbol VIH VIL IIH IIL Conditions * * Value Min 0.8 x VCC 0.0 - 10 - 200 Typ Max VCC 0.12 x VCC + 10 + 10 Unit V V A A
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MB94R215B
2. AC Characteristics
(1) Contact operation Parameter Input CLK frequency Communication speed Output signal rising Output signal falling Symbol FCLK CRATE tr tf Conditions * * Value Min 1 Typ Max 5 112 1.0 1.0 Unit MHz Kbps s s
* : External capacitance of I/O pins = 50 pF (2) Contactless operation Parameter Antenna input frequency Resonant frequency ASK modulation level Symbol Fin Fr Vask Conditions Antenna connection Antenna connection Antenna connection Antenna connection 4.0 A/m (Magnetic Field Strength) Antenna connection Antenna connection Value Min 13.553 8 Typ 13.560 16.0 Max 13.567 14 Unit MHz MHz %
Load modulation level
Vsub
30
1/H1.2 (mVpeak)
Operating magnetic field strength Communication speed
H
4.0
106
7.5
A/m Kbps
3. Pin capacity
Parameter I/O CLK RST Symbol CIH CIL CIH Value Min Typ 8.0 8.0 8.0 Max Unit pF pF pF
Note : Capacitance between pins and ground (measured by 0.1 Vpp and 1 MHz signal)
4. FRAM characteristics (data retaining characteristics)
Parameter Data retaining Number of writes 10 Conditions Ta + 55 C Ta + 55 C Value Min 10 1010 Typ Max Unit year number
MB94R215B
REFERENCE ANTENNA PATTERN
The pattern below is intended for reference data when designing the antenna. When developing a card, please take note of the module characteristics when designing the antenna pattern.
3.00 mm
3.00 mm
16.89 mm
2.00 mm 2.00 mm 39.98 mm 71.60 mm R = 0.5 mm
94RXXX
16.12 mm
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MB94R215B
RF INTERFACE in CONTACTLESS OPERATION
1. Flow at carrier ON
Communications between PICC (card) and PCD (R/W) is based on a "PCD Talk First" protocol in accordance with the procedure described below. (1) RF power is supplied to PICC by the magnetic field generated by PCD. (2) PICC is able to receive within 5 ms of RF power on. (3) PICC waits with no response until receiving a command from PCD (receive standby state). (4) PCD sends a command to PICC (sent approx. 10 ms after RF power on). (5) PICC executes the operation specified by the PCD instruction and sends a response to PCD on completion.
* Time standard at carrier ON
2 ms (Max)
5 ms (Max)
PICC : ASK reception enabled
Carrier ON
100 s to 500 s
2. Power supply
(1) Carrier frequency fc : 13.56 MHz 7 kHz (2) PICC operating magnetic field strength (when not modulated) : 4.0 A/m to 7.5 A/m
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MB94R215B
3. Interface of signal
(1) Data transmission from PCD to PICC * Communication speed fb : 105.9375 Kbps / 211.8750 Kbps * Method of modulation type : ASK * Modulation level m : PICC : 8.0% to 14.0% PCD : 30/H1.2 (mVpeak) * Bit coding Logic "1" : High magnetic field amplitude (with no modulation) Logic "0" : Low magnetic field amplitude The modulation level m is defined by the formula m = (a - b) / (a + b) as shown in the figure below. Here, a and b are the maximum and minimum amplitudes of the magnetic field strength generated by PCD. The rising and falling edges of these amplitude changes are monotonic. The transition times are 1 s or less. * Definition of modulation level
v
v = 0.2 x (a - b)
a
b tf tr
(2) Data transmission from PICC to PCD * Communication speed fb : 105.9375 Kbps (fc/128) * Method of data transmission : Load Modulation PCD always sends logic "1" during data transfer from PICC. * Load modulation sub-carrier frequency fs : 847.5 kHz (fc/16) * Method of sub-carrier modulation : BPSK Phase changes occur at valid timings on the sub-carrier rise and fall. The sub-carrier fs is modulated by the data using BPSK modulation. The carrier fc is further amplitude modulated by the phase-changed sub-carrier. * Bit coding : NRZ-L * Load Modulation load resistance : Modulation circuit resistance 150
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MB94R215B
4. Notes on carrier
When handling the device for the contactless IC cards, observe the following to prevent the improper operation or damage to the device. Keep in mind, however, that the transmission characteristics are dependent on the antenna design and reader/writer characteristics, so the values below are only for reference and the values below are not intended to guarantee the finished card characteristics. Ensure that operation and transmission characteristics have no problems in the environments where you use a card. (1) Rising of carrier Ensure that the carrier rise time is in the range 100 s to 500 s and that the carrier rises continuously with a deviation of 2.4% or less. * Rising waveform of carrier
Deviation = (A - B) / (A + B)
A B
Rising Time = 100 s to 500 s
(2) Falling of carrier Ensure that the carrier fall time is in the range 100 s to 100 ms and that the carrier falls continuously with a deviation of 2.4% or less. * Falling waveform of carrier
Deviation = (A - B) / (A + B)
B
A
Falling time = 100 s to 100 ms
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MB94R215B
(3) Stop of carrier The MB94R215B has internal capacitance to smooth the power supply and similar. Accordingly, always provide a gap of 100 ms or longer between halting and restarting the carrier to allow the internal state to stabilize. * Stop time of carrier
Carrier stop time 100 ms
(4) Carrier deviation (noise, momentary stop, etc.) Ensure that the deviation when not modulated is 2.4% or less. The following problems may occur if variation (noise) in excess of this limit occurs. * If the carrier falls within the ASK modulation level range (8 to 14%), this may be misinterpreted as a modulation signal. However, if the frame is determined to be invalid, the command receive block will be cleared and the device will return to the command standby state. * If the carrier variation exceeds the ASK modulation level range in the region 0 A/m to 12 A/m, misoperation may occur and internal circuits may reset. In this case, temporarily turn off the carrier in accordance with the precautions in "(3) Stop of carrier". If the carrier is not turned off, misoperation may corrupt internal data. * If the carrier exceeds the ASK modulation level range over 12A/m, the device may be damaged due to the increase in internal voltage. * Carrier deviation
12 A/m
4 A/m
C
D
E
Deviation = (C - D) / (C + D) x 100 = (E - C) / (E + C) x 100
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MB94R215B
(5) Operating conditions Contactless devices (cards) can only be used in a one-to-one communication with a reader/writer. Do not try to use the MB94R215B embedded card to a reader/writer with multiple other contactless cards. Use of multiple contactless devices may corrupt data or cause the device to misoperate. Using the device in the presence of strong magnetic fields (12 A/m or stronger) or with reader/writers that do not match the specifications may cause data corruption.
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MB94R215B
MARKING
MB94R215BPMB Seal diagram
MB94R215B 9 XXX
Font Character height
9 XXX
: Gothic : 1 mm : Year code 1 character : Month code 1 character : Factory symbol : Serial number 2 characters : ROM code
ORDERING INFORMATION
Part number MB94R215BPMB Package CRD-10P-M05 Remarks For Dual Interface
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MB94R215B
MEMO
18
MB94R215B
MEMO
19
FUJITSU MICROELECTRONICS LIMITED
Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 E. Arques Avenue, M/S 333 Sunnyvale, CA 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999 http://www.fma.fujitsu.com/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 47, 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 http://emea.fujitsu.com/microelectronics/ Korea FUJITSU MICROELECTRONICS KOREA LTD. 206 KOSMO TOWER, 1002 Daechi-Dong, Kangnam-Gu,Seoul 135-280 Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://www.fmk.fujitsu.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE LTD. 151 Lorong Chuan, #05-08 New Tech Park, Singapore 556741 Tel: +65-6281-0770 Fax: +65-6281-0220 http://www.fujitsu.com/sg/services/micro/semiconductor/ FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. Rm.3102, Bund Center, No.222 Yan An Road(E), Shanghai 200002, China Tel: +86-21-6335-1560 Fax: +86-21-6335-1605 http://cn.fujitsu.com/fmc/ FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, 11 Canton Road Tsimshatsui, Kowloon Hong Kong Tel: +852-2377-0226 Fax: +852-2376-3269 http://cn.fujitsu.com/fmc/tw
All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws. The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
Edited Strategic Business Development Dept.

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